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GPD Win Max PCB leaked


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For reference, the SoC in this thing is a Ryzen Embedded 1605B, described below:



Ryzen Embedded V1605B is a 64-bit quad-core embedded x86 microprocessor introduced by AMD in early 2018. This processor is based on AMD's Zen microarchitecture and is fabricated on a 14 nm process. The V1605B operates at a base frequency of 2 GHz with a TDP of 15 W and a Boost frequency of up to 3.2 GHz. This MPU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Radeon Vega 8 Graphics operating at up to 1.1 GHz.

This model supports a configurable TDP-down of 12 W and TDP-up of 25 W.

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1 minute ago, Man of Culture said:

But is it a 200% jump in heat?

M3 was 4.5W TDP chip, this is a 15W TDP chip so your just about bang on in the heat uptick guessing game! :p That said, the guess is that this device will be physically larger than the GPD win2 and so heat dispersion concerns may be less challenging when its all said and done. There is really nothing else known about this unit save the chip now so its a wait and see game.  

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